itk:module_assembly_procedure
Differences
This shows you the differences between two versions of the page.
| itk:module_assembly_procedure [2016/09/02 19:24] – created mazhang | itk:module_assembly_procedure [2016/09/02 20:07] (current) – mazhang | ||
|---|---|---|---|
| Line 3: | Line 3: | ||
| The following document describes the method for assembling dummy modules using the tape-assembly method. For the automatic glue dispension method, all steps are the same, except that the epoxy-application steps are replaced with glue-application. | The following document describes the method for assembling dummy modules using the tape-assembly method. For the automatic glue dispension method, all steps are the same, except that the epoxy-application steps are replaced with glue-application. | ||
| - | {{itk:(2016-08-24) Dummy Module Assembly Documentation.pdf|Assembly documentation}} | + | {{2016-09-02_dummy_module_assembly.pdf|Assembly documentation}} |
itk/module_assembly_procedure.1472844258.txt.gz · Last modified: 2016/09/02 19:24 by mazhang