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--- itk:testbeam [2016/09/30 18:05] – asc
+++ itk:testbeam [2016/10/04 15:11] (current) – asc
@@ Line 21: / Line 21: @@
 Details on 2 tests:
-) Testing RTI (USA vendor) to test bum bonding.  We use  2 V for low voltage and max 0.5 A. We set -80 V as bias voltage for RTI (FE-I4B) board.
+) Testing RTI (USA vendor) to test bump bonding.  We use  2 V for low voltage and max 0.5 A. We set -80 V as bias voltage for RTI (FE-I4B) board.