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--- itk:testbeam [2016/09/30 17:30]
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+++ itk:testbeam [2016/10/04 15:11] (current)
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 ======  Pixel module test beam at SLAC ======
-(prepared by S.Chekanov)
+(some notes by S.Chekanov)
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 Details on 2 tests:
-) Testing RTI (USA vendor) to test bum bonding.  We use  2 V for low voltage and max 0.5 A. We set -80 V as bias voltage for RTI (FE-I4B) board.
+) Testing RTI (USA vendor) to test bump bonding.  We use  2 V for low voltage and max 0.5 A. We set -80 V as bias voltage for RTI (FE-I4B) board.
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 Here is the setup at the end-station A:
+This is the  RTI module (uncovered):
 {{:itk:img_20160928_103349.jpg?400|Setup}}
+This is the  RTI module + RD53 prototype (uncovered):
 {{:itk:img_20160928_100735.jpg?400|Setup}}
@@ Line 191: / Line 195: @@
-Both modules from RTI have  shown signs of degradation performance. After about ~6-8h, we start to see problems for the analog
+Both modules from RTI have  shown signs of degradation in performance. After about ~6-8h, we start to see problems for the analog readout. The occupancy for analog channel efficiency for  uncalibrated module goes from 99% to 70% after 6h. The noise increases by a factor 2.
-channels. The occupancy for uncalibrated module goes from 99% to 70% after 6h. The noise increases by a factor 2.
+This problem is not related to the active beam, since the red module was not under the beam on Sep 28.
-This problem is not related to the active beam, since the red module was not under the beam in Sep 28.

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