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--- itk:testbeam [2016/09/30 17:32]
asc [Conclusions:]
+++ itk:testbeam [2016/10/04 15:11] (current)
asc
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 ======  Pixel module test beam at SLAC ======
-(prepared by S.Chekanov)
+(some notes by S.Chekanov)
@@ Line 21: / Line 21: @@
 Details on 2 tests:
-) Testing RTI (USA vendor) to test bum bonding.  We use  2 V for low voltage and max 0.5 A. We set -80 V as bias voltage for RTI (FE-I4B) board.
+) Testing RTI (USA vendor) to test bump bonding.  We use  2 V for low voltage and max 0.5 A. We set -80 V as bias voltage for RTI (FE-I4B) board.
@@ Line 30: / Line 30: @@
 Here is the setup at the end-station A:
+This is the  RTI module (uncovered):
 {{:itk:img_20160928_103349.jpg?400|Setup}}
+This is the  RTI module + RD53 prototype (uncovered):
 {{:itk:img_20160928_100735.jpg?400|Setup}}

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